EMC2301 datasheet(63/70 Pages) MICROCHIP

63 / 70 page

 2021 Microchip Technology Inc.

DS20006532A-page 63

EMC2301/2/3/5

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

2.20

MILLIMETERS

0.65 BSC

MIN

MAX

3.70

Contact Pad Length (X16)

Contact Pad Width (X16)

1.10

0.37

Microchip Technology Drawing C04-2381A

NOM

16-Lead Very Thin Plastic Quad Flat, No Lead Package (AP) - 4x4 mm Body [VQFN]

SILK SCREEN

Contact Pad Spacing

3.70

Space Between Pads

0.30

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

SMSC Legacy AP [SQFN]

ØV

0.79

Contact Pad to Center Pad (X16)

0.20

EMC2301 Datasheet(PDF) 63 Page - Microchip Technology

EMC2301 Datasheet(HTML) 63 Page - Microchip Technology

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