FS32R274VCK2VMM datasheet(72/78 Pages) NXP

72 / 78 page

package. A small amount of epoxy is placed over the thermocouple junction and over

about 1 mm of wire extending from the junction. The thermocouple wire is placed flat

against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

15.1.2 References

Semiconductor Equipment and Materials International; 3081 Zanker Road; San Jose, CA

95134 USA; (408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global

Engineering Documents at 800-854-7179 or 303-397-7956.

JEDEC specifications are available on the Web at http://www.jedec.org.

1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA

Within an Automotive Engine Controller Module,” Proceedings of SemiTherm, San

Diego, 1998, pp. 47–54.

2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-

Cooled Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.

3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board

Thermal Resistance and Its Application in Thermal Modeling,” Proceedings of

SemiTherm, San Diego, 1999, pp. 212–220.

16 Packaging

The S32R274 is offered in the following package types.

If you want the drawing for this package

Then use this document number

257-ball MAPBGA

98ASA00081D

NOTE

For detailed information regarding package drawings, refer to

www.nxp.com.

17 Reset sequence

This section describes different reset sequences and details the duration for which the

device remains in reset condition in each of those conditions.

Packaging

S32R274/S32R264 Series Data Sheet, Rev. 6, 06/2021

NXP Semiconductors

FS32R274VCK2VMM Datasheet(PDF) 72 Page - NXP Semiconductors