PCF5271CVM100 datasheet(34/56 Pages) FREESCALE

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MCF5271 Integrated Microprocessor Hardware Specification, Rev. 1.2

Preliminary Electrical Characteristics

Freescale Semiconductor

8.3

DC Electrical Specifications

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL

SPEC-883 Method 1012.1).

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL

SPEC-883 Method 1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal

characterization parameter is written in conformance with Psi-JT.

10 Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal

characterization parameter is written in conformance with Psi-JT.

The average chip-junction temperature (TJ) in °C can be obtained from:

(1)

Where:

TA= Ambient Temperature, °C

JMA= Package Thermal Resistance, Junction-to-Ambient, °C/W

PD= PINT + PI/O

PINT= IDD × VDD, Watts - Chip Internal Power

PI/O= Power Dissipation on Input and Output Pins — User Determined

For most applications PI/O < PINT and can be ignored. An approximate relationship between PD

and TJ (if PI/O is neglected) is:

(2)

Solving equations 1 and 2 for K gives:

K = PD × (TA + 273 °C) + ΘJMA × PD

2 (3)

where K is a constant pertaining to the particular part. K can be determined from equation (3)

by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and

TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA.

Table 28. DC Electrical Specifications1

Characteristic

Symbol

Min

Typical

Max

Unit

Core Supply Voltage

VDD

1.35

—

1.65

Pad Supply Voltage

OVDD

3—

3.6

Input High Voltage

VIH

0.7 OVDD

—3.65

Input Low Voltage

VIL

VSS – 0.3

—

0.35 OVDD

Input Hysteresis

VHYS

0.06 OVDD

——

Input Leakage Current

Vin = VDD or VSS, Input-only pins

Iin

–1.0

—

1.0

µA

JMA

()

273

°C

()

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