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PCA9665D Datasheet(PDF) 91 Page - NXP Semiconductors |
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PCA9665D Datasheet(HTML) 91 Page - NXP Semiconductors |
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91 / 91 page ![]() NXP Semiconductors PCA9665 Fm+ parallel bus to I2C-bus controller © NXP B.V. 2006. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 December 2006 Document identifier: PCA9665_2 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 12 Static characteristics. . . . . . . . . . . . . . . . . . . . 70 13 Dynamic characteristics . . . . . . . . . . . . . . . . . 71 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 78 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 79 16 Handling information. . . . . . . . . . . . . . . . . . . . 83 17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 83 17.2 Through-hole mount packages . . . . . . . . . . . . 83 17.2.1 Soldering by dipping or by solder wave . . . . . 83 17.2.2 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 83 17.3 Surface mount packages . . . . . . . . . . . . . . . . 83 17.3.1 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 83 17.3.2 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 85 17.3.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 85 17.4 Package related soldering information . . . . . . 85 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 87 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 87 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 89 20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 89 20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 21 Contact information. . . . . . . . . . . . . . . . . . . . . 89 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 |
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