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DAC7750IPWPR.B Datasheet(PDF) 51 Page - Texas Instruments |
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DAC7750IPWPR.B Datasheet(HTML) 51 Page - Texas Instruments |
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51 / 56 page  www.ti.com EXAMPLE STENCIL DESIGN 24X (1.5) 24X (0.45) 22X (0.65) (5.8) (R0.05) TYP (5.26) BASED ON 0.125 THICK STENCIL (3.2) BASED ON 0.125 THICK STENCIL PowerPAD TSSOP - 1.2 mm max height PWP0024J SMALL OUTLINE PACKAGE 4225860/A 04/2020 2.70 X 4.45 0.175 2.92 X 4.80 0.15 3.20 X 5.26 (SHOWN) 0.125 3.58 X 5.88 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES: (continued) 11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 12. Board assembly site may have different recommendations for stencil design. TM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 8X SYMM SYMM 1 12 13 24 METAL COVERED BY SOLDER MASK SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES 25 |
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