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L9679ETR Datasheet(PDF) 75 Page - STMicroelectronics |
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L9679ETR Datasheet(HTML) 75 Page - STMicroelectronics |
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75 / 127 page ![]() Table 11. Short between loops diagnostics decoding Fault condition on squib/ pyroswitch channel Channel leakage diagnostics with PD_CURR on (for other channels than the one under test) Channel leakage diagnostics with PD_CURR off (for all channels) No shorts No fault No fault Short to battery STB fault STB fault Short to ground STG fault STG fault Short between Loops STG fault No fault The condition of two open channels, i.e. without squib/pyroswitch resistance connecting SFx to SRx, that have a short between loops on SFx cannot be detected. If only one of the two shorted SFx pins is open, the fault will be indicated on the open channel. Squib/Pyroswitch resistance measurement During a resistance measurement, a two-step process is performed. At the first step, both the ISRC current generator and the ISNK current limited switch are enabled and connected to the selected SFx and SRx channel, through ISRC, ISRC_CURR_SEL, ISNK and RES_MEAS_CHSEL bit fields in the Loop Diagnostic Request Register (LPDIAGREQ). The ISRC current can be configured to either 40 mA or 8 mA nominal value through the ISRC_CURR_SEL bit in the LPDIAGREQ register providing the user with two different measurement range options. A differential voltage is created between the SFx and SRx pin based on the ISRC current and squib/pyroswitch resistance between the pins. The SPI interface will provide the first resistance measurement voltage (Vdiff1) based on the amplifying factor of the differential amplifier and a 10 bit internal ADC conversion. The second measurement step (bypass measurement) is performed redirecting ISRC to the selected SRx pin, while keeping ISNK on; this way, the differential amplifier and following ADC will output the offset measurement through SPI (Vdiff2). Microcontroller is then allowed to calculate the mathematical difference between first and second measurements to obtain the real squib/pyroswitch resistance value. Vdiff1=GRSQ× ISRC_*× RLKG_SF×RSQ RLKG_SF+RSQ + RSQ RLKG_SF+RSQ× VLKG_SF−VSRx_RM +Voff_RSQ Vdiff2= GRSQ×RSQ RLKG_SF+RSQ× VLKG_SF−VSRx_RM +Voff_RSQ RSQ=Vdiff1−Vdiff2 GRSQ×IRSC_* (assumingRLKG_SF⪢RSQ) The simplification in the calculation method reported above can result in some amount of error that is already incorporated in the overall tolerance of the squib/pyroswitch resistance measurement reported in the electrical parameters table. Values of each measurement step can be required addressing the proper ADCREQx code in the Diagnostic Control command (DIAGCTRLx) on Table 14. Diagnostics control register (DIAGCTRLx). This calculation is tolerant to leakages and, thanks to a dedicated EMI low-pass filter, also to high frequency noises on squib/pyroswitch lines. Moreover, L9679E features a slew rate control on the ISRC current generator to mitigate emissions. The ISRC current generator is connected to VSYNC input pin. Special care shall be considered in programming the duty cycle of the squib/pyroswitch measurements to keep the power dissipation under control, in the event VSYNC line is supplied with high voltage. High squib/pyroswitch resistance diagnostics With this test, the device is able to understand if the squib/pyroswitch resistance value is below 200 Ω, between 500 Ω and 2000 Ω or beyond 5000 Ω. During a high squib/pyroswitch resistance diagnostics, VRCM and ISNK are enabled and connected respectively to SFx and SRx on the selected channel. VREF voltage level will be output on SFx. Current flowing on SFx will be measured and compared to ISRlow and ISRhigh thresholds to identify if the resistance is above or below RSRlow or RSRhigh levels. The results are reported in the LPDIAGSTAT register. The relative flags (HSR_HI and HSR_LO) are not latched and reflect the current status of the comparators. L9679E Deployment drivers DS12485 - Rev 8 page 75/127 |
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