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C01

Figure 7-9. Reflow Profile

The reference output voltage is measured before and after the reflow process. Solder shift depends on the size,

thickness, and material of the printed circuit board. An important note is that the Figure 7-10 displays the typical

shift for exposure to one reflow profile. Exposure to multiple reflows, as is common on PCBs with surface-mount

components on both sides, causes additional shifts in the output voltage. If the PCB is exposed to multiple

reflows, the device must be soldered in the last pass to minimize the exposure to thermal stress.

Figure 7-10. Solder Shift

7.6 Power Dissipation

The REF53-Q1 voltage references are capable of source up to 30mA and sink up to 10mA of load current

across the rated input voltage range. However, when used in applications subject to high ambient temperatures,

the input voltage and load current must be carefully monitored to make sure that the device does not exceed

the maximum power dissipation rating. The maximum power dissipation of the device can be calculated with

Equation 3:

TJ=TA+PD×RθJA

(3)

where

• PD is the device power dissipation

• TJ is the device junction temperature

• TA is the ambient temperature

• RθJA is the package (junction-to-air) thermal resistance

Because of this relationship, acceptable load current in high temperature conditions can be less than the

maximum current-sourcing capability of the device. Do not operate the device outside of the maximum power

rating because doing so can result in premature failure or permanent damage to the device.

REF53-Q1

SNVSCU8 – AUGUST 2026

www.ti.com

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