ADMV4530 datasheet(7/64 Pages) AD

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Data Sheet

ADMV4530

ABSOLUTE MAXIMUM RATINGS

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Rev. C | 7 of 64

Table 4.

Parameter

Rating

VCC_DRV, VCC_AMP, and VCC2_DRV

5 V

VCC_IF, VCC2_IF, VCC_VVA, VCC_MIXER,

VCC_DOUBLER, VCC_BG

4.3 V

VCC_VCO, VCC_DIV, VCC_LDO, VCC_CP

3.6 V

VCC_1P8V

2.3 V

REF_IN to GND

−0.3 V to +2.1 V

Input Power

10 dBm

I/Q

5 dBm

Temperature

Junction

125°C

Lifetime at Maximum Junction (TJ)

106 hours

Operating Range

−40°C to +85°C

Storage Range

−55°C to +150°C

Lead Range (Soldering 60 sec)

260°C

Moisture Sensitivity Level (MSL) Rating

MSL3

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

1000 V

Field Induced Charged Device Model

(FICDM)

1000 V

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL INFORMATION

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. θJC is the junction

to case thermal resistance.

Only use θJA and θJC to compare the thermal performance of

different packages when all test conditions listed are similar to

JEDEC specifications. Otherwise, use ΨJT and ΨJB to calculate the

device junction temperature using the following equations:

TJ = (P × ΨJT) + TTOP

(1)

where:

P is the total power dissipation in the chip (W).

ΨJT is the junction to top thermal characterization number.

TTOP is package top temperature (°C). TTOP is measured at the top

center of the package.

TJ = (P × ΨJB) + TBOARD

(2)

where:

P is the total power dissipation in the chip (W).

ΨJB is the junction to board thermal characterization number.

TBOARD is the board temperature measured on the midpoint of the

longest side of the package, no more than 1 mm from the edge of

the package body (°C).

As stated in JEDEC51-12, only use Equation 1 and Equation 2

when no heat sink or heat spreader is present. When a heat sink

or heat spreader is added, use θJC_TOP or θJC_BOT (see Table 6) to

estimate or calculate the junction temperature. The preferred heat

sink or heat spreader placement for this device is to contact the

bottom of the board that has enough number of thru vias thermally

connecting the bottom paddle of the device to the heatsink along

with an appropriate thermal insulating material (TIM) to efficiently

reduce the junction temperature of the device.

Table 5 shows the temperature rise from case to junction (ΔTJC)

based on a detailed power map on a JEDEC (JESD51-2) board as

opposed to a JEDEC thermal characterization number used to get

the average temperature due to uniform power dissipation across

the ADMV4530 die. This results in a higher calculated junction tem-

perature but sets the correct limit to the maximum case temperature

with the ADMV4530 mounted on a JEDEC board. There is one

ΔTJC value that applies for both modes of operation.

To calculate TBOARD,max (Maximum case temperature referred to the

bottom of the package/nearest point on the board to the package)

use Equation 3 and Equation 4 and refer to Figure 2:

TBOARD, MAX = TJ, MAX– ΔTJC – P × θJC_BOT

(3)

if bottom side is applied to the PCB bottom surface then:

TBOARD = TBASE_PLATE + P × θBOARD+ P × θ TIM

(4)

where:

P is the total power dissipation in the chip (W).

TJ, MAX is the maximum junction temperature (°C) in Table 4.

TBOARD, MAX is the maximum board temperature measured on the

midpoint of the longest side of the package no more than 1 mm

from the edge of the package body (°C).

ΔTJC is the highest temperature rise (°C) from case to junction in

Table 5.

TBOARD is the board temperature measured on the midpoint of the

longest side of the package no more than 1 mm from the edge of

the package body (°C).

TBASE_PLATE is the temperature of the base plate of the heatsink.

θTIM is the thermal resistance (°C/W) of the TIM.

θBOARD is the thermal resistance (°C/W) of the board.

θJC_BOT is the junction to top case thermal resistance (°C/W) in

Table 6.

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