STM32F101X4 datasheet(69/73 Pages) STMICROELECTRONICS

Part #	STM32F101X4

Description	Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

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69 / 73 page

STM32F101x4, STM32F101x6

Package characteristics

Doc ID 15058 Rev 3

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6.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 8: General operating conditions on page 29.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x JA)

Where:

●

TA max is the maximum ambient temperature in C,

●



JA is the package junction-to-ambient thermal resistance, in C/W,

●

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

●

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = (VOL × IOL) + ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

6.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org.

Table 49.

Package thermal characteristics

Symbol

Parameter

Value

Unit



JA

Thermal resistance junction-ambient

LQFP 64 - 10 x 10 mm / 0.5 mm pitch

45

°C/W

Thermal resistance junction-ambient

LQFP 48 - 7 x 7 mm / 0.5 mm pitch

55

Thermal resistance junction-ambient

VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch

18

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