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STM32F101X4 Datasheet(PDF) 29 Page - STMicroelectronics

Part # STM32F101X4
Description  Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F101X4 Datasheet(HTML) 29 Page - STMicroelectronics

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STM32F101x4, STM32F101x6
Electrical characteristics
Doc ID 15058 Rev 3
29/74
5.3
Operating conditions
5.3.1
General operating conditions
Table 6.
Current characteristics
Symbol
Ratings
Max.
Unit
IVDD
Total current into VDD/VDDA power lines (source)
(1)
1.
All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
150
mA
IVSS
Total current out of VSS ground lines (sink)
(1)
150
IIO
Output current sunk by any I/O and control pin
25
Output current source by any I/Os and control pin
 25
IINJ(PIN)
(2)(3)
2.
IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS.
3.
Negative injection disturbs the analog performance of the device. See note in Section 5.3.16: 12-bit ADC
characteristics.
Injected current on NRST pin
± 5
Injected current on High-speed external OSC_IN and Low-
speed external OSC_IN pins
± 5
Injected current on any other pin(4)
4.
When several inputs are submitted to a current injection, the maximum
I
INJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with
I
INJ(PIN) maximum current injection on four I/O port pins of the device.
± 5
I
INJ(PIN)
(2)
Total injected current (sum of all I/O and control pins)(4)
± 25
Table 7.
Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
150
°C
Table 8.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fHCLK
Internal AHB clock frequency
0
36
MHz
fPCLK1
Internal APB1 clock frequency
0
36
fPCLK2
Internal APB2 clock frequency
0
36
VDD
Standard operating voltage
2
3.6
V
VDDA
(1)
Analog operating voltage
(ADC not used)
Must be the same potential
as VDD
(2)
23.6
V
Analog operating voltage
(ADC used)
2.4
3.6
VBAT
Backup operating voltage
1.8
3.6
V


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