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NX2113 Datasheet(PDF) 16 Page - Microsemi Corporation |
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NX2113 Datasheet(HTML) 16 Page - Microsemi Corporation |
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16 / 19 page ![]() NX2113/2113A 16 Rev. 2.0 11/18/05 operates. Before half of the start up time, the Feedback Under Voltage Lock Out comparator is disabled. After half of start up time, the Feedback UVLO comparator is enabled. The FB UVLO threshold is set to be half of voltage at the positive input of error amplifier. With this set up, if the output is short before soft start, the Feedback UVLO comparator can catch it and turn off the driver. The short circuit operation waveform during normal operation and during the soft start are shown as follows. CH3-FB voltage 0.5V/DIV CH1-SW voltage 10V/DIV CH4-load current 10A/DIV Figure 15 - Operation waveforms during short con- dition. CH2-output voltage 1V/DIV CH4-load current 10A/DIV Figure 16 - Feedback UVLO with start up at short. The Feedback UVLO can provide certain short cir- cuit protection. However, since feedback does not have accurate information of current, this protection only pro- vides certain level of over current protection. MOSFET should design such that it can survive with high pulse current for a short period of time. The value of the capacitor on enable pin to ground and the resistor value of voltage divider on enable pin should be big enough to keep enable pin high during short. Otherwise, once output shorts, the input bus volt- age drops, the chip is disabled before Feedback UVLO takes effect, and the system goes into hiccup status. This phenomena is easy to be found during system startup, if related resistor and capacitor value is not big enough. CH2-Output voltage 1V/DIV CH4-load current 10A/DIV Figure 17 -Hiccup with start up at short. Layout Considerations The layout is very important when designing high frequency switching converters. Layout will affect noise pickup and can cause a good design to perform with less than expected results. Start to place the power components, make all the connection in the top layer with wide, copper filled ar- eas. The inductor, output capacitor and the MOSFET should be close to each other as possible. This helps to reduce the EMI radiated by the power traces due to the high switching currents through them. Place input ca- pacitor directly to the drain of the high-side MOSFET, to |
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