Analog Integrated Circuit Device Data

Freescale Semiconductor

5

33781

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to GND unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Supply Voltages

VSUPn

Load Dump VSUPn (300ms maximum - either pin)

VCC

VDD

VPP

-0.3 to 26.5

40

-0.3 to 7.0

-0.3 to 3.1

-0.3 to 10.0

V

Maximum Voltage on Logic Input/Output Pins

–

V

Maximum Voltage on DBUS Pins

V

Maximum DBUS Pin Current

400

mA

Maximum Logic Pin Current

20

mA

ESD Voltage(1)

Human Body Model (HBM)

Machine Model (MM)

Charge Device Model (CDM)

Corner pins

All other pins

±2000

±200

±750

±500

V

THERMAL RATINGS

Storage Temperature

-55 to 150

°C

Operating Ambient Temperature

-40 to 90

°C

Operating Junction Temperature

-40 to 150

°C

Thermal Shutdown (Bus Drivers and Pseudo Bus Switch)

155 to 190

°C

Resistance, Junction-to-Ambient

71

°C/W

Resistance, Junction-to-Board

6

°C/W

Soldering Reflow Temperature

260

°C

Peak Package Reflow Temperature During Reflow(2),(3)

Note 3

°C

Notes

1.

2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.