MSP430F4783IPZ datasheet(23/79 Pages) TI

23 / 79 page

MSP430F47x3, MSP430F47x4

MIXED SIGNAL MICROCONTROLLER

SLAS545C − MAY 2007 − REVISED MARCH 2011

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

absolute maximum ratings (see Note 1)

Voltage applied at VCC to VSS

−0.3 V to 4.1 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage applied to any pin (see Note 2)

−0.3 V to VCC + 0.3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Diode current at any device terminal .

±2 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature, Tstg: (unprogrammed device, see Note 3)

−55

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . .

(programmed device, see Note 3)

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . .

NOTES:

1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended

operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

2. All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage

is applied to the TDI/TCLK pin when blowing the JTAG fuse.

3. Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with

peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.

MSP430F4783IPZ Datasheet(PDF) 23 Page - Texas Instruments