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MFRC63002R Datasheet(PDF) 2 Page - NXP Semiconductors |
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MFRC63002R Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 118 page ![]() MFRC630 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.1 — 6 September 2012 227531 2 of 118 NXP Semiconductors MFRC630 Contactless reader IC SPI up to 10 Mbit/s I2C-bus interfaces up to 400 kBd in Fast mode, up to 1000 kBd in Fast mode plus RS232 Serial UART up to 1228.8 kBd, with voltage levels dependent on pin voltage supply Separate I2C-bus interface for connection of a secure access module (SAM) FIFO buffer with size of 512 byte for highest transaction performance Flexible and efficient power saving modes including hard power down, standby and low-power card detection Cost saving by integrated PLL to derive system CPU clock from 27.12 MHz RF quartz crystal 3.3 V to 5 V power supply Up to 8 free programmable input/output pins Typical operating distance in read/write mode for communication to a ISO/IEC 14443A/MIFARE Card up to 12 cm, depending on the antenna size and tuning 4. Quick reference data [1] VDD(PVDD) must always be the same or lower voltage than VDD. [2] Ipd is the sum of all supply currents [3] IDD(TVDD) depends on VDD(TVDD) and the external circuitry connected to TX1 and TX2. [4] Typical value: Assumes the usage of a complementary driver configuration and an antenna matched to 40 between pins TX1, TX2 at 13.56 MHz. 5. Ordering information [1] Delivered in one tray [2] Delivered in five trays Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage 3 5 5.5 V VDD(TVDD) TVDD supply voltage [1] 35 5.5 V VDD(PVDD) PVDD supply voltage 3 5 5.5 V Ipd power-down current PDOWN pin pulled HIGH [2] - 8 40 nA IDD supply current - 17 20 mA IDD(TVDD) TVDD supply current [3][4] - 100 200 mA Tamb ambient temperature 25 +25 +85 C Tstg storage temperature no supply voltage applied 40 +25 +100 C Table 2. Ordering information Type number Package Name Description Version MFRC63002HN/TRAYB[1] HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; MSL1, 32 terminals + 1 central ground; body 5 5 0.85 mm SOT617-1 MFRC63002HN/TRAYBM[2] MFRC63002HN/T/R[3] |
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