MCP2155_13 datasheet(41/52 Pages) MICROCHIP

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 2001-2013 Microchip Technology Inc.

Preliminary

DS21690B-page 41

MCP2155

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

18-Lead PDIP (300 mil)

Example:

18-Lead SOIC (300 mil)

Example:

20-Lead SSOP (209 mil, 5.30 mm)

Example:

XXXXXXXXXXXXXXXXX

XXXXXYYWWNNN

XXXXXXXXXXXXXXXXX

XXXXXYYWWNNN

XXXXXXXXXXX

XXXYYWWNNN

MCP2155I/SS

XXXXXXXXXXX

XXXYYWWNNN

MCP2155-I/SO

XXXXXXXXXXXXXXXXX

XXXXXYYWWNNN

MCP2155-I/P

XXXXXXXXXXXXXXXXX

XXXXXYYWWNNN

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

21690B.book Page 41 Thursday, January 10, 2013 1:06 PM

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