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MCP2155 Datasheet(PDF) 10 Page - Microchip Technology |
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MCP2155 Datasheet(HTML) 10 Page - Microchip Technology |
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10 / 52 page ![]() MCP2155 DS21690B-page 10 Preliminary 2001-2013 Microchip Technology Inc. 2.8 Minimizing Power The device can be placed in a low power mode by dis- abling the device (holding the EN pin at the low state). The internal state machine is monitoring this pin for a low level, and once this is detected the device is dis- abled and enters into a low power state. 2.8.1 RETURNING TO DEVICE OPERATION When disabled, the device is in a low power state. When the EN pin is brought to a high level, the device will return to the operating mode. The device requires a delay of 1024 TOSC before data may be transmitted or received. 2.9 Network Layering Reference Model Figure 2-5 shows the ISO Network Layering Reference Model. The shaded areas are implemented by the MCP2155, the cross-hatched area is implemented by an infrared transceiver, and the unshaded areas need to be implemented by the Host controller. FIGURE 2-5: ISO REFERENCE LAYER MODEL OSI REFERENCE LAYERS Application Presentation Session Transport Network Data Link Layer LLC (Logical Link Control) Acceptance Filtering Overload Notification Recovery Management MAC (Medium Access Control) Data Encapsulation/Decapsulation Frame Coding (stuffing, destuffing) Medium Access Management Error Detection Error Signaling Acknowledgment Serialization/Deserialization Physical Layer PLS (Physical Signalling) Bit Encoding/Decoding Bit Timing Synchronization PMA (Physical Medium Attachment) Driver/Receiver Characteristics MDI (Medium Dependent Interface) Connectors Fault confinement (MAC-LME) Bus Failure management (PLS-LME) Supervisor Regions implemented by the MCP2155 Has to be implemented in Host Controller firmware Regions implemented by the Optical Transceiver logic (such as a PIC® microcontroller) 21690B.book Page 10 Thursday, January 10, 2013 1:06 PM |
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