DSPIC33FJ09GS302 datasheet(18/352 Pages) MICROCHIP

18 / 352 page

dsPIC33FJ06GS001/101A/102A/202A and dsPIC33FJ09GS302

DS75018C-page 18

 2011-2012 Microchip Technology Inc.

FIGURE 2-1:

RECOMMENDED

MINIMUM CONNECTION

2.2.1

TANK CAPACITORS

On boards with power traces running longer than

six inches in length, it is suggested to use a tank capac-

itor for integrated circuits including DSCs to supply a

local power source. The value of the tank capacitor

should be determined based on the trace resistance

that connects the power supply source to the device,

and the maximum current drawn by the device in the

application. In other words, select the tank capacitor so

that it meets the acceptable voltage sag at the device;

typical values range from 4.7 µF to 47 µF.

2.3

Capacitor on Internal Voltage

Regulator (VCAP)

A low-ESR (<0.5 Ohms) capacitor is required on the

VCAP pin, which is used to stabilize the voltage regulator

output voltage. The VCAP pin must not be connected to

VDD, and must have a capacitor between 4.7 µF and

10 µF, 16V connected to ground. The type can be

ceramic or tantalum. Refer to Section 25.0 “Electrical

Characteristics” for additional information.

The placement of this capacitor should be close to the

VCAP. It is recommended that the trace length not

exceed one-quarter inch (6 mm). Refer to Section 22.2

“On-Chip Voltage Regulator” for details.

2.4

Master Clear (MCLR) Pin

The MCLR pin provides for two specific device

functions:

• Device Reset

• Device Programming and Debugging

During device programming and debugging, the

resistance and capacitance that can be added to the

pin must be considered. Device programmers and

debuggers drive the MCLR pin. Consequently,

specific voltage levels (VIH and VIL) and fast signal

transitions must not be adversely affected. Therefore,

specific values of R and C will need to be adjusted

based on the application and PCB requirements.

For example, as shown in Figure 2-2, it is recommended

that the capacitor, C, be isolated from the MCLR pin

during programming and debugging operations.

Place the components shown in Figure 2-2 within

one-quarter inch (6 mm) from the MCLR pin.

FIGURE 2-2:

EXAMPLE OF MCLR PIN

CONNECTIONS

dsPIC33F

VDD

VSS

VDD

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

VDD

MCLR

0.1 µF

Ceramic

L1(1)

10 µF

Tantalum

Note 1:

As an option, instead of a hard-wired connection, an

inductor (L1) can be substituted between VDD and

AVDD to improve ADC noise rejection. The inductor

impedance should be less than 1

 and the inductor

capacity greater than 10 mA.

Where:

FCNV

--------------

 LC



-----------------------

fC



----------------------



 2

(i.e., ADC conversion rate/2)

Note 1:

 10 k is recommended. A suggested

starting value is 10 k

. Ensure that the

MCLR pin VIH and VIL specifications are

met.

 470 will limit any current flowing into

MCLR from the external capacitor, C, in the

event of MCLR pin breakdown due to

Electrostatic Discharge (ESD) or Electrical

Overstress (EOS). Ensure that the MCLR

pin VIH and VIL specifications are met.

R1(2)

R(1)

VDD

MCLR

dsPIC33F

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