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DSPIC30F4012 Datasheet(PDF) 237 Page - Microchip Technology |
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DSPIC30F4012 Datasheet(HTML) 237 Page - Microchip Technology |
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237 / 238 page  © 2010 Microchip Technology Inc. DS70135G-page 237 dsPIC30F4011/4012 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. dsPIC30F 4011AT -30I/PF-000 Example: dsPIC30F4011AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A Trademark Architecture Flash E = Extended High Temp -40°C to +125°C I = Industrial -40°C to +85°C Temperature Device ID Package SP = 28L PDIP (Skinny DIP) SO = 28L SOIC P = 40L PDIP ML = 44L QFN 8x8 PT = 44L TQFP 10x10 S = Die (Waffle Pack) W = Die (Wafers) Memory Size in Bytes 0 = ROMless 1 = 1K to 6K 2 = 7K to 12K 3 = 13K to 24K 4 = 25K to 48K 5 = 49K to 96K 6 = 97K to 192K 7 = 193K to 384K 8 = 385K to 768K 9 = 769K and Up Custom ID (3 digits) or T = Tape and Reel A,B,C… = Revision Level Engineering Sample (ES) Speed 20 = 20 MIPS 30 = 30 MIPS |
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