DSPIC30F4012 datasheet(178/238 Pages) MICROCHIP

178 / 238 page

dsPIC30F4011/4012

DS70135G-page 178

24.1

DC Characteristics

TABLE 24-1:

OPERATING MIPS VS. VOLTAGE

VDD Range

Temp Range

Max MIPS

dsPIC30F401X-30I

dsPIC30F401X-20E

4.5-5.5V

-40°C to +85°C

—

4.5-5.5V

-40°C to +125°C

—

3.0-3.6V

-40°C to +85°C

—

3.0-3.6V

-40°C to +125°C

—

2.5-3.0V

-40°C to +85°C

—

TABLE 24-2:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

dsPIC30F401X-30I

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

dsPIC30F401X-20E

Operating Junction Temperature Range

-40

—

+150

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD X (IDD –

∑IOH)

PINT + PI/O

I/O Pin power dissipation:

PI/O =

∑({VDD – VOH} X IOH) + ∑(VOL X IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

θJA

TABLE 24-3:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 28-pin SPDIP (SP)

θJA

—

°C/W

Package Thermal Resistance, 28-pin SOIC (SO)

θJA

—

°C/W

Package Thermal Resistance, 40-pin PDIP (P)

θJA

—

°C/W

Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT)

θJA

—

°C/W

Package Thermal Resistance, 44-pin QFN (ML)

θJA

—

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-ja (

θJA) numbers are achieved by package simulations.

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