MACH211SP-7/10/12/15/20

23

TYPICAL THERMAL CHARACTERISTICS

Measured at 25

°C ambient. These parameters are not tested.

Plastic

θ

The data listed for plastic

θ

heat-flow paths in plastic-encapsulated devices are complex, making the

θ

package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of

the package. Furthermore,

θ

a constant temperature. Therefore, the measurements can only be used in a similar environment. TQFP thermal measurements

are taken with components on a six-layer printed circuit board.

Parameter

Symbol

Parameter Description

Typ

Unit

TQFP

PLCC

θ

jc

Thermal impedance, junction to case

11.3

4

°C/W

θ

ja

Thermal impedance, junction to ambient

41

30.4

°C/W

θ

jma

Thermal impedance, junction to ambient

with air flow

200 lfpm air

35

18.5

°C/W

400 lfpm air

33.7

15.9

°C/W

600 lfpm air

32.6

13.5

°C/W

800 lfpm air

32

12.8

°C/W