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AN2386 Datasheet(PDF) 27 Page - STMicroelectronics |
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AN2386 Datasheet(HTML) 27 Page - STMicroelectronics |
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27 / 30 page ![]() AN2386 Conclusions 27/30 4 Conclusions This paper has studied the effect of the temperature on the MOSFET threshold voltage and its thermal coefficient. In particular, a mathematical model for both parameters was achieved and a comparison with real measurement was performed considering three low voltage power MOSFET devices by ST; DEVICE1, DEVICE2 and DEVICE3. The simulated and real data obtained for all the devices under test are quite close and, thus confirming the validation of the theory. The model has highlighted that, in order to decreases in absolute value TVTC to avoid thermal run-away of the device, the thickness oxide, silicon and the gate doping concentration must be decreased. However, minimizing TVTC and obtaining a standard threshold voltage device can't be done by decreasing the three parameters together, they must be rearranged as in the example shown in Figure 23. and Figure 24. of this article. Another important result shown in this paper regards the example of the device DEVICE3. In this case, the higher total charge concentration in the channel involves a band-gap narrowing that increases in absolute value TVTC and makes the device more thermally instable. |
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