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AN4630 Datasheet(PDF) 16 Page - STMicroelectronics |
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AN4630 Datasheet(HTML) 16 Page - STMicroelectronics |
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16 / 33 page ![]() Design recommendations when using QFN32 package AN4630 4 Design recommendations when using QFN32 package Design recommentations when using QFN32 package The application board TOP layer layout using the QFN32 package is shown in Figure 11: "QFN32 package application board TOP layer". Figure 11: QFN32 package application board TOP layer It is crucial to connect very well the ground of the exposed pad of the QFN32 to the ground on the application board. So many vias are necessary to be sure that the parasitic inductor introduced from each via is negligible. 16/33 DocID027262 Rev 1 |
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