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AN4630 Datasheet(PDF) 27 Page - STMicroelectronics |
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AN4630 Datasheet(HTML) 27 Page - STMicroelectronics |
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27 / 33 page ![]() AN4630 Design recommendations when using WLCSP34 package Figure 22: Focus on BlueNRG biasing pins On TOP layer avoid putting metal inside the red zone. This zone is very sensible to the ground layer and the presence of a metal plane can affect the operation of the device. The VBAT1 connection is improved using two laser filled vias. Figure 23: Other TOP layer constraints The RF ground in the TOP layer is “hot” so it could generate pulling power. To avoid this risk, it is necessary to not merge the RF ground to the others ground on the TOP and INNER2 layers, but merge all the different grounds in the INNER3 layer. DocID027262 Rev 1 27/33 |
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