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KAI-2001 Datasheet(PDF) 34 Page - ON Semiconductor |
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KAI-2001 Datasheet(HTML) 34 Page - ON Semiconductor |
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34 / 36 page ![]() KAI−2001 www.onsemi.com 34 Die to Package Alignment Figure 37. Die to Package Alignment 1. Center of image is offset from center of package by (0.00, 0.00) mm nominal. 2. Die is aligned within ±2 degree of any package cavity edge. Notes: Dimensions Units: IN [MM] Tolerances: Unless otherwise specified Ceramic ±1% no less than 0.005″ L/F ±1% no more than 0.005″ |
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