AS-MLV-P2 datasheet(18/24 Pages) AMSCO

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ams Datasheet

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[v1-01] 2015-Oct-12

AS-MLV-P2 − Soldering Information

Handling

The AS-MLV-P2 should be handled carefully, shear stress should

be avoided. The sensor is protected against particles and liquids

by a membrane. This membrane shall not be removed or

touched.

Soldering Instructions

The AS-MLV-P2 can be soldered in standard reflow soldering

ovens. The reflow oven shall be purged with clean air. Other

gases must be avoided. For the lead free reflow process a

standard process IPC/JEDEC J-STD-020 with peak temperature

up to maximum 230°C on surface is suggested. See Figure 19

for more detailed description.

Note(s): The device shall be kept clear of liquids; therefore a

PCB washing process must be avoided in any case.

For manual soldering: contact must be limited to 5 seconds at

a maximum temperature of 350°C.

Figure 19:

Solder Reflow Graph

Soldering Information

AS-MLV-P2 Datasheet(PDF) 18 Page - ams AG