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LNBH25S Datasheet(PDF) 17 Page - STMicroelectronics |
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LNBH25S Datasheet(HTML) 17 Page - STMicroelectronics |
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17 / 37 page ![]() LNBH25S Typical application circuits DocID026736 Rev 2 17/37 Component Notes L1 With COMP=0, use 10 µH inductor with ISAT > IPEAK where IPEAK is the boost converter peak current, or with COMP=1 and C2 = 22 µF, use 6.8 µH inductor with ISAT > IPEAK where IPEAK is the boost converter peak current Figure 7: DiSEqC 2.x application circuit Table 6: DiSEqC 2.x bill of material Component Notes R1 (RSEL) SMD resistor. Refer to Table 13: "Electrical characteristics" and ISEL pin description in Table 2: "Pin description" C1 > 25 V electrolytic capacitor, 100 µF or higher is suitable or > 25 V ceramic capacitor, 10 µF or higher is suitable C2 With COMP = 0, > 25 V electrolytic capacitor, 100 µF or higher is suitable or with COMP = 1, > 35 V ceramic capacitor, 22 µF (or 2 x10 µF) or higher is suitable C3 From 470 nF to 2.2 µF ceramic capacitor placed as closer as possible to VUP pin. Higher values allow lower DC-DC noise C5 From 100 nF to 220 nF ceramic capacitor placed as closer as possible to VOUT pin. Higher values allow lower DC-DC noise C4, C7 220 nF ceramic capacitors. To be placed as closer as possible to VOUT pin C6 10 nF ceramic capacitors D1 STPS130A or similar Schottky diode |
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