CD54HC4051, CD74HC4051

CD54HCT4051, CD74HCT4051, CD54HC4052, CD74HC4052, CD54HCT4052

CD74HCT4052, CD54HC4053, CD74HC4053, CD54HCT4053, CD74HCT4053

www.ti.com

SCHS122K – NOVEMBER 1997 – REVISED SEPTEMBER 2015

6.4 Thermal Information

CD74HC4051

N (PDIP)

NS (SO)

PW (TSSOP)

UNIT

16 PINS

16 PINS

16 PINS

Junction-to-ambient thermal resistance

49.0

83.0

107.7

°C/W

Junction-to-case (top) thermal resistance

36.3

41.2

42.4

°C/W

Junction-to-board thermal resistance

29.0

43.3

52.8

°C/W

Junction-to-top characterization parameter

21.2

9.2

4.2

°C/W

Junction-to-board characterization parameter

28.9

43.0

52.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics: HC Devices

TEST CONDITIONS

PARAMETERS

MIN

TYP

MAX

UNIT

(V)

(V)

(V)

(V)

25°C

1.5

–40°C to

1.5

2

85°C

–55°C to

1.5

125°C

25°C

3.15

–40°C to

3.15

High-level input voltage

4.5

85°C

V

–55°C to

3.15

125°C

25°C

4.2

–40°C to

4.2

6

85°C

–55°C to

4.2

125°C

25°C

0.5

–40°C to

0.5

2

85°C

–55°C to

0.5

125°C

25°C

1.35

–40°C to

1.35

Low-level input voltage

4.5

85°C

V

–55°C to

1.35

125°C

25°C

1.8

–40°C to

1.8

6

85°C

–55°C to

1.8

125°C

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