LMP7709MTSLASHNOPB datasheet(2/41 Pages) TI1

2 / 41 page

AOL

Gmin

fGBWP

UNITY-GAIN STABLE OP AMP

DECOMPENSATED OP AMP

LMP7707, LMP7708, LMP7709

SNOSAW5B – JUNE 2007 – REVISED MARCH 2013

www.ti.com

Open Loop Frequency Response

Figure 1. Increased Bandwidth for Same Supply Current at AV> 10

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Human Body Model

2000V

ESD Tolerance(3)

Machine Model

200V

Charge Device Model

1000V

VIN Differential

±300 mV

Supply Voltage (VS = V

+ – V−)

13.2V

Voltage at Input/Output Pins

V++ 0.3V to V−

− 0.3V

Input Current

10 mA

Storage Temperature Range

−65°C to +150°C

Junction Temperature(4)

+150°C

Infrared or Convection (20 sec)

235°C

Soldering Information

Wave Soldering Lead Temp. (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Temperature Range(2)

−40°C to +125°C

Supply Voltage (VS = V

+ – V−)

2.7V to 12V

5-Pin SOT-23

265°C/W

8-Pin SOIC

190°C/W

Package Thermal Resistance (

θJA)

(2)

8-Pin VSSOP

235°C/W

14-Pin TSSOP

122°C/W

14-Pin SOIC

145°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics tables.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.

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