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TMS320VC5501 Datasheet(PDF) 4 Page - Texas Instruments |
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TMS320VC5501 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 193 page ![]() Revision History 4 December 2002 − Revised November 2004 SPRS206H PAGE(S) NO. ADDITIONS/CHANGES/DELETIONS 132 Section 4, Support: − added Section 4.1, Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability − added Section 4.1.1, Initialization Requirements for Boundary Scan Test − added Section 4.1.2, Boundary Scan Description Language (BSDL) Model 132 Added section title “4.2 Documentation Support” 132 Section 4.2, Documentation Support: − updated title of SPRU146 to “TMS320VC5501/5502/5503/5507/5509 DSP Inter-Integrated Circuit (I2C) Module Reference Guide” − updated title of SPRU592 to “TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide” 176 Table 5−43, HPI Read and Write Timing Requirements: − H13 [tw(DSL)]: deleted “K = 1”, “K = 2”, and “K = 4” column − H14 [tw(DSH)]: − deleted “K = 1”, “K = 2”, and “K = 4” column − changed MIN value from 3P, P, and 1.75P to 2P (ns) − deleted “K = divider ratio ...” footnote − added “A host must not initiate transfer requests ...” footnote 177 Table 5−44, HPI Read and Write Switching Characteristics: − added “A host must not initiate transfer requests ...” footnote 187 Section 6, Mechanical Data: − deleted 201-terminal GZZ package drawing and 176-pin PGF package drawing − Mechanical drawings of the 201-terminal GZZ, 201-terminal ZZZ, and 176-pin PGF packages will be appended to this document via an automated process. 187 Table 6−1, Thermal Resistance Characteristics (Ambient): − changed “GZZ” to “GZZ, ZZZ” − updated “Adding thermal vias will significantly improve ...” footnote to include ZZZ package 188 Table 6−2, Thermal Resistance Characteristics (Case): − changed “GZZ” to “GZZ, ZZZ” 189 Added Section 6.2, Packaging Information |
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