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SN65LVDT2DBVT Datasheet(PDF) 20 Page - Texas Instruments

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Part # SN65LVDT2DBVT
Description  High-Speed Differential Line Drivers and Receivers
PDF  42 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN65LVDT2DBVT Datasheet(HTML) 20 Page - Texas Instruments

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LVDS
1A
C
200 ps
0.001 F
0.2V
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Maximum Step Change Supply Current
chip
Rise Time
Maximum Power Supply Noise
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C
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V
D
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SN65LVDS1, SN65LVDS2, SN65LVDT2
SLLS373L – JULY 1999 – REVISED DECEMBER 2014
www.ti.com
10.2.1.2 Detailed Design Procedure
10.2.1.2.1
Driver Supply Voltage
The SN65LVDS1 driver is operated from a single supply. The device can support operation with a supply as low
as 2.4 V and as high as 3.6 V. The driver output voltage is dependent upon the chosen supply voltage. As shown
in Driver Electrical Characteristics, the differential output voltage is nominally 350 mV over the complete output
range. The minimum output voltage stays within the specified LVDS limits (247 mV to 454 mV) for a 3.3-V
supply. If the supply range is between 2.4 V and 3 V, the minimum output voltage may be as low as 200 mV. If a
communication link is designed to operate with a supply within this lower range, the channel noise margin will
need to be looked at carefully to ensure error-free operation.
10.2.1.2.2
Driver Bypass Capacitance
Bypass capacitors play a key role in power distribution circuitry. Specifically, they create low-impedance paths
between power and ground. At low frequencies, a good digital power supply offers very low-impedance paths
between its terminals. However, as higher frequency currents propagate through power traces, the source is
quite often incapable of maintaining a low-impedance path to ground. Bypass capacitors are used to address this
shortcoming. Usually, large bypass capacitors (10
μF to 1000 μF) at the board-level do a good job up into the
kHz range. Due to their size and length of their leads, they tend to have large inductance values at the switching
frequencies of modern digital circuitry. To solve this problem, one must resort to the use of smaller capacitors
(nF to
μF range) installed locally next to the integrated circuit.
Multilayer ceramic chip or surface-mount capacitors (size 0603 or 0805) minimize lead inductances of bypass
capacitors in high-speed environments, because their lead inductance is about 1 nH. For comparison purposes,
a typical capacitor with leads has a lead inductance around 5 nH.
The value of the bypass capacitors used locally with LVDS chips can be determined by the following formula
according to Johnson, equations 8.18 to 8.21. A conservative rise time of 200 ps and a worst-case change in
supply current of 1 A covers the whole range of LVDS devices offered by Texas Instruments. In this example, the
maximum power supply noise tolerated is 200 mV; however, this figure varies depending on the noise budget
available in your design. (1)
(1)
(2)
The following example lowers lead inductance and covers intermediate frequencies between the board-level
capacitor (>10 µF) and the value of capacitance found above (0.001 µF). You should place the smallest value of
capacitance as close as possible to the chip.
Figure 19. Recommended LVDS Bypass Capacitor Layout
(1)
Howard Johnson & Martin Graham.1993. High Speed Digital Design – A Handbook of Black Magic. Prentice Hall PRT. ISBN number
013395724.
20
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Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: SN65LVDS1 SN65LVDS2 SN65LVDT2



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