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SN65LVDT2DBVT Datasheet(PDF) 25 Page - Texas Instruments

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Part # SN65LVDT2DBVT
Description  High-Speed Differential Line Drivers and Receivers
PDF  42 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN65LVDT2DBVT Datasheet(HTML) 25 Page - Texas Instruments

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SN65LVDS1, SN65LVDS2, SN65LVDT2
www.ti.com
SLLS373L – JULY 1999 – REVISED DECEMBER 2014
10.2.3.2 Detailed Design Procedure
10.2.3.2.1
Interconnecting Media
The interconnect in a multidrop system differs considerably from a point-to-point system. While point-to-point
interconnects are straightforward, and well understood, the bus type architecture encountered with multidrop
systems requires more careful attention. We will use Figure 22 above to explore these details.
The most basic multidrop system would include a single driver, located at a bus origin, with multiple receiver
nodes branching off the main line, and a final receiver at the end of the transmission line, co-located with a bus
termination resistor. While this would be the most basic multidrop system, it has several considerations not yet
explored.
The location of the transmitter at one bus end allows the design concerns to be simplified, but this comes at the
cost of flexibility. With a transmitter located at the origin, a single bus termination at the far-end is required. The
far-end termination absorbs the incident traveling wave. The flexibility lost with this arrangement is thus: if the
single transmitter needed to be relocated on the bus, at any location other than the origin, we would be faced
with a bus with one open-circuited end, and one properly terminated end. Locating the transmitter say in the
middle of the bus may be desired to reduce (by ½) the maximum flight time from the transmitter to receiver.
Another new feature in Figure 22 is clear in that every node branching off the main line results in stubs. The
stubs should be minimized in any case, but have the unintended effect of locally changing the loaded impedance
of the bus.
To a good approximation, the characteristic transmission line impedance seen into any cut point in the unloaded
multipoint or multidrop bus is defined by
√L/C, where L is the inductance per unit length and C is the capacitance
per unit length. As capacitance is added to the bus in the form of devices and interconnections, the bus
characteristic impedance is lowered. This may result in signal reflections from the impedance mismatch between
the unloaded and loaded segments of the bus.
If the number of loads is constant and can be distributed evenly along the line, reflections can be reduced by
changing the bus termination resistors to match the loaded characteristic impedance. Normally, the number of
loads are not constant or distributed evenly and the reflections resulting from any mismatching must be
accounted for in the noise budget.
10.2.3.3 Application Curve
Figure 23. Typical Driver Output Eye Pattern in Multidrop System
Copyright © 1999–2014, Texas Instruments Incorporated
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Product Folder Links: SN65LVDS1 SN65LVDS2 SN65LVDT2



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