TPS51218

SLUS935B

– MAY 2009 – REVISED FEBRUARY 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

ORDERING DEVICE

OUTPUT

MINIMUM

PACKAGE

PINS

NUMBER

SUPPLY

QUANTITY

TPS51218DSCR

10

Tape and reel

3000

–40°C to 85°C

Plastic SON PowerPAD

TPS51218DSCT

10

Mini reel

250

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

VBST

–0.3 to 37

–0.3 to 7

V

SW

–5 to 30

V5IN, EN, TRIP, VFB, RF

–0.3 to 7

DRVH

–5 to 37

–0.3 to 7

< 20 ns

–2.5 to 7

V

DRVL

–0.5 to 7

DRVL, pulse width

< 20 ns

–2.5 to 7

PGOOD

–0.3 to 7

Junction temperature range

150

°C

Storage temperature range

–55 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal unless otherwise noted.

(3)

Voltage values are with respect to the SW terminal.

DISSIPATION RATINGS

2-oz. trace and copper pad with solder.

PACKAGE

DERATING FACTOR

POWER RATING

POWER RATING

1.54 W

15 mW/

°C

0.62 W

(1)

Enhanced thermal conductance by thermal vias is used beneath thermal pad as shown in Land Pattern information.

2

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