TPS65982ABZBHR datasheet(93/121 Pages) TI1

93 / 121 page

PP_5V0

VBUS

Fast

current

limit

PP_5V0 Gate Control

and Current Limit

PP_HV

Fast

current

limit

PP_HV Gate Control

and Current Limit

HV Gate Control and Sense

PP_EXT

AGND

TPS65982

www.ti.com

SLVSD02D – MARCH 2015 – REVISED JUNE 2019

Product Folder Links: TPS65982

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Figure 86. Schottky on VBUS for Current Surge Protection

12 Layout

12.1 Layout Guidelines

Proper routing and placement will maintain signal integrity for high-speed signals and improve the thermal

dissipation from the TPS65982 power path. The combination of power and high-speed data signals are easily

routed if the following guidelines are followed. It is a best practice to consult with a printed circuit board (PCB)

manufacturer to verify manufacturing capabilities.

12.1.1 TPS65982 Recommended Footprints

12.1.1.1 Standard TPS65982 Footprint (Circular Pads)

Figure 87 shows the TPS65982 footprint using a 0.25mm pad diameter. This footprint is applicable to boards that

will be using an HDI PCB process that uses smaller vias to fan-out into the inner layers of the PCB. This footprint

requires via fill and tenting and is recommended for size-constrained applications. The circular footprint allows for

easy fan-out into other layers of the PCB and better thermal dissipation into the GND planes. Figure 88 shows

the recommended via sizing for use under the balls. The size is 5mil hole and 10mil diameter. This via size will

allow for approximately 1.5A current rating at 3 mΩ of DC resistance with 1.6nH of inductance. It is

recommended to verify these numbers with board manufacturing processes used in fabrication of the PCB. This

footprint is available for download on the TPS65982 product folder on the TPS65982 product folder.

TPS65982ABZBHR Datasheet(PDF) 93 Page - Texas Instruments