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OPA2990IDDFR Datasheet(PDF) 12 Page - Texas Instruments |
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OPA2990IDDFR Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 81 page ![]() 6.6 Thermal Information for Quad Channel THERMAL METRIC(1) OPA4990, OPA4990S UNIT D (SOIC) PW (TSSOP) RTE(2) (WQFN) RUC (WQFN) 14 PINS 14 PINS 16 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 105.2 134.7 53.5 143.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.2 55.0 58.3 46.4 °C/W RθJB Junction-to-board thermal resistance 61.1 79.0 28.6 81.8 °C/W ψJT Junction-to-top characterization parameter 21.4 9.2 2.1 1.0 °C/W ψJB Junction-to-board characterization parameter 60.7 78.1 28.6 81.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 12.6 N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) This package option is preview for OPA4990. OPA990, OPA2990, OPA4990 SBOS933H – FEBRUARY 2019 – REVISED MAY 2021 www.ti.com 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: OPA990 OPA2990 OPA4990 |
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