ST25DV04KC datasheet(19/203 Pages) STMICROELECTRONICS

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RF access

Static Register

I2C access

Address

Type

Name

Function

Device select

Address

Type

0Fh

RW(1)

LOCK_CFG

Protect RF Write to system configuration registers

E2=1, E1=1

000Fh

RW(2)

N/A

WO (5)

LOCK_DSFID DSFID lock status

E2=1, E1=1

0010h

WO (6)

LOCK_AFI

AFI lock status

E2=1, E1=1

0011h

N/A

RW(5)

DSFID

DSFID value

E2=1, E1=1

0012h

N/A

RW(6)

AFI

AFI value

E2=1, E1=1

0013h

N/A

MEM_SIZE

Memory size value in blocks, 2 bytes

E2=1, E1=1

0014h to 0015h

BLK_SIZE

Block size value in bytes

E2=1, E1=1

0016h

N/A

IC_REF

IC reference value

E2=1, E1=1

0017h

UID

Unique identifier, 8 bytes

E2=1, E1=1

0018h to 001Fh

No access

IC_REV

IC revision

E2=1, E1=1

0020h

ST Reserved

E2=1, E1=1

0021h

ST Reserved

E2=1, E1=1

0022h

ST Reserved

E2=1, E1=1

0023h

I2C_PWD

I2C security session password, 8 bytes

E2=1, E1=1

0900h to 0907h R/W (7) (8)

N/A

WO (9)

RF_PWD_0

RF configuration security session password, 8 bytes

No access

N/A

WO(9)

RF_PWD_1

RF user security session password 1, 8 bytes

N/A

WO(9)

RF_PWD_2

RF user security session password 2, 8 bytes

N/A

WO(9)

RF_PWD_3

RF user security session password 3, 8 bytes

1. Write access is granted if RF configuration security session is open and configuration is not locked

(LOCK_CFG register equals to 0).

2. Write access if I2C security session is open.

3. Write access to bit 0 if Block 00h is not already locked and to bit 1 if Block 01h is not already locked.

4. LOCK_CCFILE content is only readable through reading the Block Security Status of blocks 00h and 001h

(see Section 5.6.3 User memory protection)

5. Write access if DSFID is not locked

6. Write access if AFI is not locked.

7. Write access with I2C Write Password command, only after presenting a correct I2C password.

8. Read access is granted if I2C security session is open.

9. Write access only if corresponding RF security session is open.

ST25DV04KC ST25DV16KC ST25DV64KC

System configuration area

DS13519 - Rev 3

page 19/203

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