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STM32U535NET6QTR Datasheet(PDF) 130 Page - STMicroelectronics

Part # STM32U535NET6QTR
Description  Ultra-low-power Arm® Cortex®-M33 MCUTrustZone®FPU,240 DMIPS, up to 512 KB flash memory, 274 KB SRAM
PDF  278 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U535NET6QTR Datasheet(HTML) 130 Page - STMicroelectronics

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Electrical characteristics
STM32U535xx
130/278
DS14217 Rev 1
VIN
(4)
Input voltage on FT_c pins
VSS - 0.3
5.5
V
Input voltage on any other pins
VSS - 0.3
4.0
VREF+ - VDDA
Allowed voltage difference for
VREF+ > VDDA
-0.4
|∆VDDx|
Variations between different VDDx
power pins of the same domain
-50.0
mV
|VSSx-VSS|
Variations between all the different
ground pins(7)
-50.0
1. All main power (VDD, VDDSMPS, VDDA, VDDUSB, VDDIO2, VBAT) and ground (VSS, VSSA, VSSSMPS) pins must
always be connected to the external power supply, in the permitted range.
2. The I/O structure options listed in this table can be a concatenation of options including the option explicitly listed. For
instance TT_a refers to any TT I/O with _a option. TT_xx refers to any TT I/O and FT_xx refers to any FT I/O.
3. VDDIO1 or VDDIO2, VDDIO1 = VDD.
4. VIN maximum must always be respected. Refer to Table 30 for the maximum allowed injected current values.
5. To sustain a voltage higher than 4 V, the internal pull-up/pull-down resistors must be disabled.
6. This formula has to be applied only on the power supplies related to the I/O structure described in the pin definition table.
7. Including VREF- pin.
Table 29. Voltage characteristics(1)(2) (continued)
Symbol
Ratings
Min
Max
Unit
Table 30. Current characteristics
Symbol
Ratings
Max
Unit
∑IVDD
Total current into sum of all VDD power lines (source)(1)
200
mA
∑IVSS
Total current out of sum of all VSS ground lines (sink)(1)
200
IVDD
Maximum current into each VDD power pin (source)(1)
100
IVSS
Maximum current out of each VSS ground pin (sink)(1)
100
IIO
Output current sunk by any I/O and control pin
20
∑I(PIN)
Total output current sunk by sum of all I/Os and control pins(2)
120
Total output current sourced by sum of all I/Os and control pins(2)
120
IINJ(PIN)(3)(4) Injected current on FT_xx, TT_xx, RST pins
-5/+0
∑|IINJ(PIN)|
Total injected current (sum of all I/Os and control pins)(5)
±25
1. All main power (VDD, VDDSMPS, VDDA, VDDUSB, VDDIO2, VBAT) and ground (VSS, VSSA, VSSSMPS) pins must
always be connected to the external power supplies, in the permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be
sunk/sourced between two consecutive power supply pins, referring to high pin count QFP packages.
3. Positive injection (when VIN > VDDIOx) is not possible on these I/Os and does not occur for input voltages lower than the
specified maximum value.
4. A negative injection is induced by VIN < VSS. IINJ(PIN) must never be exceeded. Refer also to Table 29 for the minimum
allowed input voltage values.
5. When several inputs are submitted to a current injection, the maximum ∑|IINJ(PIN) is the absolute sum of the negative
injected currents (instantaneous values).



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