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M95P16-EXCS/EF Datasheet(PDF) 55 Page - STMicroelectronics

Part # M95P16-EXCS/EF
Description  Ultra low power 16 Mbit serial SPI page EEPROM with dual and quad outputs
PDF  63 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M95P16-EXCS/EF Datasheet(HTML) 55 Page - STMicroelectronics

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11.3
WLCSP8 package information
This WLCSP is an 8-ball, 1.363 x 1.809 mm, 0.4 mm pitch, wafer level chip scale package.
Figure 44. WLCSP8 - Outline
E
A
B
D
aaa C (2x)
Orientation reference
aaa
(2x)
A3
A2
A1
A
3
ccc
b
2
C A B
C
ddd C
bbb C
TOP VIEW
SIDE VIEW
e
G
F
e
G
F
Orientation reference
BOTTOM VIEW
1.
Drawing is not to scale.
2.
Dimension is measured at the maximum bump diameter parallel to primary datum C.
3.
Primary datum C and seating plane are defined by the spherical crowns of the bump.
Table 31. WLCSP8 - Mechanical data
Symbol
millimeters
inches1
Min
Typ
Max
Min
Typ
Max
A
0.520
0.550
0.580
0.0205
0.0216
0.0228
A1
-
0.194
-
-
0.0076
-
A2
(including A3)
-
0.355
-
-
0.0140
-
A3
-
0.025
-
-
0.0010
-
b(2)
-
0.268
-
-
0.0105
-
D
-
1.363
1.393
-
0.0537
0.0548
E
-
1.809
1.839
-
0.0712
0.0724
e
-
0.400
-
-
0.0157
-
F
-
0.305
-
-
0.0120
-
G
-
0.282
-
-
0.0111
-
aaa
-
-
0.110
-
-
0.0043
bbb
-
-
0.110
-
-
0.0043
ccc
-
-
0.110
-
-
0.0043
ddd
-
-
0.060
-
-
0.0024
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum C.
M95P16-I M95P16-E
WLCSP8 package information
DS13710 - Rev 1
page 55/63



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