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DSP56600FM/AD Datasheet(PDF) 44 Page - NXP Semiconductors

Part # DSP56600FM/AD
Description  INTEGRATED CELLULAR BASEBAND PROCESSOR
PDF  76 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

DSP56600FM/AD Datasheet(HTML) 44 Page - NXP Semiconductors

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Preliminary
2-2
DSP56652 Technical Data Sheet
MOTOROLA
Specifications
Thermal characteristics
THERMAL CHARACTERISTICS
Table 2-1
Absolute Maximum Ratings (GND = 0 V)
Rating
Symbol
Value
Unit
Internal supply voltage
VCCI
Ð0.3 to +2.75
V
External supply voltage
VCCE
Ð0.3 to +3.6
V
Operating temperature range
TA
Ð40 to +85
°C
Storage temperature
TSTG
Ð55 to +125
°C
Table 2-2
Thermal Characteristics
Characteristic
Symbol
BGA Value3
Unit
Junction-to-ambient thermal resistance1
RqJA or qJA
TBD
ûC/W
Junction-to-case thermal resistance2
RqJC or qJC
TBD
ûC/W
Thermal characterization parameter
YJT
TBD
ûC/W
Notes:
1.
Junction-to-ambient thermal resistance is based on measurements on a horizontal-single-
sided printed circuit board per SEMI G38-87 in natural convection.(SEMI is Semiconductor
Equipment and Materials International, 805 East Middlefield Rd., Mountain View, CA
94043, (415) 964-5111)
2.
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI
G30-88, with the exception that the cold plate temperature is used for the case temperature.
3.
These are measured values; testing is not complete. Values were measured on a non-
standard four-layer thermal test board (two internal planes) at one watt in a horizontal
configuration.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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