DSP56600FMSLASHAD datasheet(63/76 Pages) NXP

Part #	DSP56600FM/AD

Description	INTEGRATED CELLULAR BASEBAND PROCESSOR

PDF	76 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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63 / 76 page

Preliminary

MOTOROLA

DSP56652 Technical Data Sheet

3-1

SECTION

PACKAGING

PACKAGE INFORMATION

This section provides information about the available packages for this product. The

DSP56652 is available in a 196-pin plastic ball grid array (PBGA) package.

The DSP56652 part (ROM-based DSP program memory) is delivered in a 15-mm

(outline) PBGA. Compatibility between the footprints of the package is maintained to

minimize impact to the customerÕs application board routing, such that the same

board can be used for both the DSP56651 and DSP56652.

196 PBGA (GT), 15 x 15 mm, 1-mm Pitch Solder Balls

The DSP56652 is offered in the JEDEC-standard, 15-mm PBGA with 1 mm pitch

solder balls. Refer to Figure 3-1 on page 3-3 and Table 3-1 for package drawing and

dimensions, respectively.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

DSP56600FM/AD Datasheet(PDF) 63 Page - NXP Semiconductors