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RYZ024A Datasheet(PDF) 5 Page - Renesas Technology Corp

Part # RYZ024A
Description  LTE Category M1 Module
PDF  40 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RYZ024A Datasheet(HTML) 5 Page - Renesas Technology Corp

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RYZ024A
Datasheet
R19DS0115EU0101 Rev.1.01
Page 5 of 38
Nov.14.22
USIM Interfaces
This section describes the SIM0 and SIM1 Interfaces.
SIM0 Interface
This is the main external SIM interface. It can be used with removable or non-removable SIM cards or with
soldered SIM chips. The power supply of the SIM is managed by the modem to ensure lowest power
consumption of the SIM.
Note: See section Power for behavior of IOs in Deep Sleep mode.
Table 3.
SIM0 Signals
Pad
#
Pad Name
Primary
Function
Power
Group
Direction
Pad
type1
State at
rest
Comment
42
SIM0_CLK
SIM0_CLK
PVDD_1V8
Out
BIDIR
Out-0,
2mA
Main SIM
45
SIM0_DETECT2
SIM0_DETECT
PMU_5V
In
IN
HighZ
Main SIM
44
SIM0_IO
SIM0_IO
PVDD_1V8
In/Out
BIDIR
HighZ,
2mA
Main SIM
43
SIM0_RSTN
SIM0_RSTN
PVDD_1V8
Out
BIDIR
Out-0,
2mA
Main SIM
73
SIM0_VCC3
SIM0_VCC
PVDD_1V8
Out
Supply
Out-0,
2mA
Main SIM
1.
USIM pad type’s electrical characteristics are detailed in Table 19.
2.
SIM0_DETECT is active HIGH (HIGH when a card is present, LOW when no card is present). It can be configured
as a WAKE pin via software command.
3.
See range of values in Table 13.
SIM1 Interface
This interface can be used as a second SIM interface for RYZ024A, typically used for soldered SIM chips
(since it lacks SIM detect and SIM VCC). If design only has one SIM, it is preferred then to use the main SIM
interface (see Section SIM0 Interface above).
Note: See section Power for behavior of IOs in Deep Sleep mode.
Table 4.
SIM1 Signals
Pad # Pad Name
Primary
Function
Alternate
Function1
Power
Group
Direction
Pad
Type2
State at
reset
40
GPIO26/SIM1_CLK
GPIO26
SIM1_CLK
PVDD_1V8
Out
BIDIR
Out-0,
2 mA
41
GPIO27/SIM1_RESETN
GPIO27
SIM1_RESETN
PVDD_1V8
Out
BIDIR
Out-0,
2 mA
39
GPIO25/SIM1_IO
GPIO25
SIM1_IO
PVDD_1V8
In/Out
BIDIR
HighZ,
2 mA
1. Alternate functions will be available in future versions via SW upgrade.
2. Pad types electrical characteristics are detailed in Table 19.
Important: Both SIM0 and SIM1 interfaces use 1.8 V signaling.



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