RYZ024A datasheet(20/40 Pages) RENESAS

20 / 40 page

RYZ024A

Datasheet

R19DS0115EU0101 Rev.1.01

Page 20 of 38

Nov.14.22

Storage and Mounting

The RYZ024A module is Moisture Level 3 rated as per JEDEC industrial standard: http://www.ipc.org/TOC/J-

STD-033D-TOC.pdf. The RYZ024A is JEDEC J-STD-033D compliant and can be stored at T < 40 °C and

relative humidity < 90%. The RYZ024A can support up to 3 reflows with 250°C maximum.

Table 27.

Reflow Profile

Profile Feature

Solder Paste Alloy

Sn 96.5/Ag 3.0/Cu 0.5 (Lead Free solder paste)

Peak Package Body Temperature

235°C to 245°C

Fusion Time

Temp: over 220°C

Time: 60 seconds ~ 90 seconds

Pre-heat / Soak

Temp: 150 ~ 200°C

Time: 60 seconds ~ 120 seconds

Ramp-up Rate

< 3°C/second

Ramp-down Rate

-3°C to 0°C/second

Air Composition

N2, O2 contents less than 1,500 ppm

Figure 14.

Reflow Profile Parameters

Recommended stencil thickness: 0.1 mm to 0.13 mm (prefer 0.1 mm). More detail on PCB land pattern will

be provided in a future edition of the document.

Reliability Specification

RYZ024A has been tested against Renesas’s industrial reliability specification as described in the following

table.

Table 28.

Reliability Test Plan

Item

Test Conditions

Standard

No. of

Samples

Result

Preconditioning

• Bake: 125°C / 24 hours

• MSL3: 30°C/60% RH, 192 hrs

• SAT (CSAM & TSCAN)

• X-ray

• Reflow 3 cycles at Tp: 250 ±2°C

• SAT (CSAM & TSCAN)

JESD22-A113

175

PASS

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