MPC750ECSLASHD datasheet(39/44 Pages) NXP

39 / 44 page

MPC750A RISC Microprocessor Hardware Speciﬁcations

System Design Information

Figure 22. Thermal Performance of Select Thermal Interface Material

The board designer can choose between several types of thermal interface. Heat sink adhesive materials

should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment

shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive

materials provided by the following vendors:

Dow-Corning Corporation

517-496-4000

Dow-Corning Electronic Materials

PO Box 0997

Midland, MI 48686-0997

Chomerics, Inc.

617-935-4850

77 Dragon Court

Woburn, MA 01888-4850

Thermagon Inc.

216-741-7659

3256 West 25th Street

Cleveland, OH 44109-1668

Loctite Corporation

860-571-5100

1001 Trout Brook Crossing

Rocky Hill, CT 06067

AI Technology (e.g. EG7655)

609-882-2332

1425 Lower Ferry Rd.

Trent, NJ 08618

0.5

1.5

1020304050607080

Silicone Sheet (0.006 inch)

Bare Joint

Floroether Oil Sheet (0.007 inch)

Graphite/Oil Sheet (0.005 inch)

Synthetic Grease

Contact Pressure (psi)

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

IVE

D B

Y F

INC

MPC750EC/D Datasheet(PDF) 39 Page - NXP Semiconductors

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