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MPC750EC/D Datasheet(PDF) 8 Page - NXP Semiconductors |
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MPC750EC/D Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 44 page ![]() 8 MPC750A RISC Microprocessor Hardware Specifications Electrical and Thermal Characteristics Table 4 provides the package thermal characteristics for the MPC750. The MPC750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the MPC750 RISC Microprocessor User’s Manual for more information on the use of this feature. Specifications for the thermal sensor portion of the TAU are found in Table 5. L2 bus supply voltage L2OVdd 2.5 to 3.465 V Input voltage Vin GND to OVdd V Die-junction temperature Tj 0 to 105 °C Tj -40 to 105 °C 1 Note: These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. 1. For extended temperature parts marked MPC750ARXnnnTH or MPC740ARXnnnTH only (where nnn is the operating frequency from Table 8. Table 4. Package Thermal Characteristics Characteristic Symbol Value Rating CBGA package thermal resistance, junction-to-case thermal resistance (typical) θ JC 0.03 °C/W CBGA package thermal resistance, die junction-to-lead thermal resistance (typical) θ JB 3.8 °C/W Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management. Table 5. Thermal Sensor Specifications At recommended operating conditions (See Table 3) Num Characteristic Min Max Unit Notes 1 Temperature range 0 127 °C 1 2 Comparator settling time 20 — µs 2 3 Resolution 4 — °C 3 Notes: 1. The temperature is the junction temperature of the die. The thermal assist unit’s raw output does not indicate an absolute temperature, but it must be interpreted by software to derive the absolute junction temperature. For information about the use and calibration of the TAU, see Motorola Application Note AN1800/D, “Programming the Thermal Assist Unit in the MPC750 Microprocessor”. 2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR. 3. Guaranteed by design and characterization. Table 3. Recommended Operating Conditions (Continued) Characteristic Symbol MPC750A Value Unit Notes Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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