TMP112ASLASHBSLASHN datasheet(30/47 Pages) TI1

30 / 47 page

Device

SCL

SDA

GND

V+

ALERT

ADD0

(F)

10 nF

≥

(F)

5 k

≤

Supply Voltage

Figure 8-3. Noise Reduction Techniques (for SOT563-6 package as an example)

8.2.3 Application Curves

Figure 8-4 shows the step response of the TMP112 family (for SOT563-6 package) to a submersion in an oil

bath of 100ºC from room temperature (27ºC). The time-constant, or the time for the output to reach 63% of the

input step, is 0.8s (for SOT563-6 package) and TBDs (for X2SON-5 package). The time-constant result depends

on the printed-circuit board (PCB) that the TMP112 family is mounted. For this test, the TMP112 family was

soldered to a two-layer PCB that measured 0.375 inches × 0.437 inches.

Time (s)

-1

100

Figure 8-4. Temperature Step Response (for SOT563-6 package)

8.2.4 Power Supply Recommendations

The TMP112 family operates with power supply in the range of 1.4 to 3.6 V. The device is optimized for operation

at 3.3-V supply but can measure temperature accurately in the full supply range.

A power-supply bypass capacitor is required for proper operation. Place this capacitor as close as possible

to the supply and ground pins of the device. A typical value for this supply bypass capacitor is 0.01 μF (for

SOT563-6 package) and 0.1 μF (for X2SON-5 package). Applications with noisy or high-impedance power

supplies can require additional decoupling capacitors to reject power-supply noise.

8.3 Layout

8.3.1 Layout Guidelines

Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended

value of this bypass capacitor is 0.01 μF (for SOT563-6 package) and 0.1 μF (for X2SON-5 package). Additional

decoupling capacitance can be added to compensate for noisy or high-impedance power supplies. Pull up the

open-drain output pins (SDA, SCL) through 2-kΩ or 1.2-kΩ pullup resistors. However, using a minimal SDA and

ALERT pins pull-up current is recommended to prevent self-heating and temperature accuracy reduction.

TMP112

SBOS473J – MARCH 2009 – REVISED FEBRUARY 2024

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