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EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

TYP

(0.21) TYP

EXPOSED METAL

CLEARANCE

(0.48)

(0.78)

4X (0.42)

4X (0.22)

( 0.25)

4X (0.26)

4X (0.06)

( 0.1)

VIA

(R0.05) TYP

X2SON - 0.4 mm max height

DPW0005A

PLASTIC SMALL OUTLINE - NO LEAD

4223102/D 03/2022

SYMM

1

2

3

4

SYMM

LAND PATTERN EXAMPLE

SOLDER MASK DEFINED

SCALE:60X

SOLDER MASK

OPENING, TYP

METAL UNDER

SOLDER MASK

TYP

5

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note

in literature No. SLUA271 (www.ti.com/lit/slua271).

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TMP112

SBOS473J – MARCH 2009 – REVISED FEBRUARY 2024

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