FS32K142HAT0MLHT datasheet(69/84 Pages) NXP

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FS32K142HAT0MLHT Datasheet(PDF) 69 Page - NXP Semiconductors

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J12

J10

J11

Input data valid

Output data valid

TCLK

TDI/TMS

TDO

J14

TDO

J13

Figure 34. Test Access Port timing

Thermal attributes

7.1 Description

The tables in the following sections describe the thermal characteristics of the device.

NOTE

Junction temperature is a function of die size, on-chip power

dissipation, package thermal resistance, mounting side (board)

temperature, ambient temperature, air flow, power dissipation

or other components on the board, and board thermal resistance.

7.2 Thermal characteristics

Thermal attributes

S32K1xx Data Sheet, Rev. 9, 09/2018

NXP Semiconductors

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