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STM32L4S5AI Datasheet(PDF) 255 Page - STMicroelectronics |
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STM32L4S5AI Datasheet(HTML) 255 Page - STMicroelectronics |
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255 / 275 page  DocID030322 Rev 2 255/275 STM32L4S5xx, STM32L4S7xx and STM32L4S9xx Package information 272 Figure 69. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package recommended footprint ddd - - 0.080 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 121. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA) Dimension Recommended values Pitch 0.80 mm Dpad 0.400 mm Dsm 0.550 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 120. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A02Y_FP_V1 Dpad Dsm |
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