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STM32L4S5AI Datasheet(PDF) 252 Page - STMicroelectronics

Part # STM32L4S5AI
Description  Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 150DMIPS, up to 2MB Flash, 640KB SRAM, LCD-TFT & MIPI DSI, AESHASH
PDF  275 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L4S5AI Datasheet(HTML) 252 Page - STMicroelectronics

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DocID030322 Rev 2
Figure 66. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array recommended footprint
Note:
Non-solder mask defined (NSMD) pads are recommended.
Note:
4 to 6 mils solder paste screen printing process.
b
0.230
0.280
0.330
0.0091
0.0110
0.0130
D
6.950
7.000
7.050
0.2736
0.2756
0.2776
D1
5.950
6.000
6.050
0.2343
0.2362
0.2382
E
6.950
7.000
7.050
0.2736
0.2756
0.2776
E1
5.950
6.000
6.050
0.2343
0.2362
0.2382
e
-
0.500
-
-
0.0197
-
F
0.450
0.500
0.550
0.0177
0.0197
0.0217
ddd
-
-
0.100
-
-
0.0039
eee
-
-
0.150
-
-
0.0059
fff
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 119. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA)
Dimension
Recommended values
Pitch
0.5 mm
Dpad
0.27 mm
Dsm
0.35 mm typ. (depends on the soldermask
registration tolerance)
Solder paste
0.27 mm aperture diameter.
Table 118. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid
array package mechanical data (continued)
Symbol
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
Max.
MS18965V2
Dsm
Dpad



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