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STM32L4S5AI Datasheet(PDF) 252 Page - STMicroelectronics |
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STM32L4S5AI Datasheet(HTML) 252 Page - STMicroelectronics |
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252 / 275 page ![]() Package information STM32L4S5xx, STM32L4S7xx and STM32L4S9xx 252/275 DocID030322 Rev 2 Figure 66. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array recommended footprint Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. b 0.230 0.280 0.330 0.0091 0.0110 0.0130 D 6.950 7.000 7.050 0.2736 0.2756 0.2776 D1 5.950 6.000 6.050 0.2343 0.2362 0.2382 E 6.950 7.000 7.050 0.2736 0.2756 0.2776 E1 5.950 6.000 6.050 0.2343 0.2362 0.2382 e - 0.500 - - 0.0197 - F 0.450 0.500 0.550 0.0177 0.0197 0.0217 ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 119. UFBGA169 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 118. UFBGA169 - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. MS18965V2 Dsm Dpad |
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