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STM32L4S5AI Datasheet(PDF) 262 Page - STMicroelectronics |
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STM32L4S5AI Datasheet(HTML) 262 Page - STMicroelectronics |
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262 / 275 page ![]() Package information STM32L4S5xx, STM32L4S7xx and STM32L4S9xx 262/275 DocID030322 Rev 2 Figure 75. WLCSP - 144 bump, 5.24x 5.24 mm, 0.40 mm pitch, wafer level chip scale, recommended footprint 1. Dimensions are expressed in millimeters. Table 123. WLCSP - 144 bump, 5.24x 5.24 mm, 0.40 mm pitch, wafer level chip scale, mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 3 decimal digits. Min Typ Max Min Typ Max A- - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3 - 0.025(2) 2. A3 value is guaranteed by technology design value. - - 0.0010 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 5.22 5.24 5.26 0.205 0.206 0.207 E 5.22 5.24 5.26 0.205 0.206 0.207 e - 0.40 - - 0.016 - e1 - 4.40 - - 0.173 - e2 - 4.40 - - 0.173 - F - 0.420(3) 3. This value is calculated from over value D and e1. - - 0.0165 - G - 0.420(4) 4. This value is calculated from over value E and e2. - - 0.0165 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 A085_WLCSP144_FP_V1 Dpad Dsm |
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