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STM32L4S5AI Datasheet(PDF) 265 Page - STMicroelectronics |
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STM32L4S5AI Datasheet(HTML) 265 Page - STMicroelectronics |
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265 / 275 page  DocID030322 Rev 2 265/275 STM32L4S5xx, STM32L4S7xx and STM32L4S9xx Package information 272 Figure 78. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package recommended footprint e - 0.500 - - 0.0197 - Z - 0.750 - - 0.0295 - ddd - 0.080 - - 0.0031 - eee - 0.150 - - 0.0059 - fff - 0.050 - - 0.0020 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 126. UFBGA132 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 mm Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Ball diameter 0.280 mm Table 125. UFBGA132 - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max UFBGA132_A0G8_FP_V1 Dpad Dsm |
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